Ruggedising the electronics enclosures

By and large these days all electronics components are tropicalised for severe environmental conditions. However the shock and vibration proofing along with EMI/EMC is a challenging task in any electronics enclosure designs.

Below are the main issues to be considered while designing the packaging of electronic baords.

1. Temperature cycling
2. Shock
3. Vibration
4. EMI/EMC
5. Humidity control

Each of the above heading is by itself is a big enough topic to discuss in details. I will start posting these techniques one by one in my coming blogs.